A.4 · Semiconductor & Silicon Architecture
High-Speed Interconnect Standards
UCIe, CXL 3.x, PCIe 6.0/7.0, and 800G Ethernet logic
What we build
Protocol stack implementations and bridge architectures for UCIe (die-to-die chiplet links), CXL 3.x (memory pooling and coherency), PCIe 6.0/7.0 (peripheral I/O), and 400G/800G Ethernet fabrics. We build the digital logic for arbitration, flow control, retransmission, and cache coherency protocols.
Capabilities
- UCIe protocol stacks for die-to-die chiplet links
- CXL 3.x implementations for memory pooling and coherency
- PCIe 6.0 and 7.0 controllers for peripheral I/O
- 400G and 800G Ethernet fabric logic
- Arbitration, flow control, retransmission, and cache coherency engines
Related services
How it connects
Where it sits in the stack.
This system, and the two it hands off to. None of them can be optimized alone.
Interconnect Standards
Protocol stack implementations and bridge architectures for UCIe (die-to-die chiplet links), CXL 3.x (memory pooling and coherency), PCIe 6.0/7.0 (peripheral I/O), and 400G/800G Ethernet fabrics.
Advanced Process Control
A distributed, real-time inference engine that ingests 10,000+ sensor data points per second from fab tools (etch, deposition, lithography).
Semiconductor & Silicon · see serviceEDA for Advanced Nodes
A suite of algorithms that convert RTL (Register-Transfer Level) code into a physical GDSII file ready for mask generation.
Semiconductor & Silicon · see serviceBring us the whole stack.
Tell us where latency is costing you, from the die to the data center to the control room. An architect replies with a first read of the problem, not a sales deck.