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A.2 · Semiconductor & Silicon Architecture

Electronic Design Automation (EDA) for Advanced Nodes

From RTL to a mask-ready GDSII at 3nm

  • RTL
  • GDSII
  • DRC/LVS
  • GAAFET
  • 3nm
  • 5nm
Die photograph of a processor made on a 3nm process

What we build

A suite of algorithms that convert RTL (Register-Transfer Level) code into a physical GDSII file ready for mask generation. Includes logic synthesis, place-and-route, clock tree synthesis, DRC/LVS, and parasitic extraction—optimized for 3nm, 5nm, and GAAFET architectures.

Capabilities

  • Logic synthesis from Register-Transfer Level code
  • Place-and-route and clock tree synthesis tuned for nanosecond-level skew
  • Design rule checking and layout-versus-schematic verification (DRC/LVS)
  • Parasitic extraction optimized for 3nm, 5nm, and GAAFET architectures

Related services

How it connects

Where it sits in the stack.

This system, and the two it hands off to. None of them can be optimized alone.

01You are here

EDA for Advanced Nodes

A suite of algorithms that convert RTL (Register-Transfer Level) code into a physical GDSII file ready for mask generation.

02

Advanced Process Control

A distributed, real-time inference engine that ingests 10,000+ sensor data points per second from fab tools (etch, deposition, lithography).

Semiconductor & Silicon · see service
03

SerDes & Chip IP

Mixed-signal PHY IP blocks including PAM4/NRZ transceivers up to 224Gbps per lane, adaptive equalizers (FFE/DFE) for >40dB channel loss, clock-data recovery (CDR) circuits, and built-in self-test (BIST) for link health monitoring.

Semiconductor & Silicon · see service

Bring us the whole stack.

Tell us where latency is costing you, from the die to the data center to the control room. An architect replies with a first read of the problem, not a sales deck.