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Category A · 4 services

Semiconductor & Silicon Architecture

From the physics of a 3nm transistor to the I/O that carries its signal off the die.

A patterned silicon wafer catching the light, its dies in rows of colour

We work at the layer most software never sees: process control inside the fab, the EDA algorithms that turn RTL into a mask-ready layout, and the mixed-signal IP that moves 224 gigabits per second down a single lane.

What we build

A.1

Advanced Process Control (APC) Software for Fabs

Real-time inference across every tool in the fab

A distributed, real-time inference engine that ingests 10,000+ sensor data points per second from fab tools (etch, deposition, lithography). It runs multivariate statistical models and lightweight neural networks to detect equipment drift and outputs automated recipe adjustments (R2R) and predictive maintenance alerts.

  • R2R control
  • Multivariate SPC
  • Etch
  • Deposition
  • Lithography
What we build
A.2

Electronic Design Automation (EDA) for Advanced Nodes

From RTL to a mask-ready GDSII at 3nm

A suite of algorithms that convert RTL (Register-Transfer Level) code into a physical GDSII file ready for mask generation. Includes logic synthesis, place-and-route, clock tree synthesis, DRC/LVS, and parasitic extraction—optimized for 3nm, 5nm, and GAAFET architectures.

  • RTL
  • GDSII
  • DRC/LVS
  • GAAFET
  • 3nm
  • 5nm
What we build
A.3

High-Speed SerDes and Chip IP

PAM4 and NRZ transceivers up to 224 Gbps per lane

Mixed-signal PHY IP blocks including PAM4/NRZ transceivers up to 224Gbps per lane, adaptive equalizers (FFE/DFE) for >40dB channel loss, clock-data recovery (CDR) circuits, and built-in self-test (BIST) for link health monitoring. Delivered as synthesizable RTL or hardened GDSII.

  • PAM4
  • NRZ
  • FFE/DFE
  • CDR
  • BIST
  • 224 Gbps
What we build
A.4

High-Speed Interconnect Standards

UCIe, CXL 3.x, PCIe 6.0/7.0, and 800G Ethernet logic

Protocol stack implementations and bridge architectures for UCIe (die-to-die chiplet links), CXL 3.x (memory pooling and coherency), PCIe 6.0/7.0 (peripheral I/O), and 400G/800G Ethernet fabrics. We build the digital logic for arbitration, flow control, retransmission, and cache coherency protocols.

  • UCIe
  • CXL 3.x
  • PCIe 6.0
  • PCIe 7.0
  • 400G
  • 800G Ethernet
What we build

How it connects

Inside semiconductor.

The systems in this area, and what each one hands to the next.

01

Advanced Process Control

A distributed, real-time inference engine that ingests 10,000+ sensor data points per second from fab tools (etch, deposition, lithography).

What we build
02

EDA for Advanced Nodes

A suite of algorithms that convert RTL (Register-Transfer Level) code into a physical GDSII file ready for mask generation.

What we build
03

SerDes & Chip IP

Mixed-signal PHY IP blocks including PAM4/NRZ transceivers up to 224Gbps per lane, adaptive equalizers (FFE/DFE) for >40dB channel loss, clock-data recovery (CDR) circuits, and built-in self-test (BIST) for link health monitoring.

What we build
04

Interconnect Standards

Protocol stack implementations and bridge architectures for UCIe (die-to-die chiplet links), CXL 3.x (memory pooling and coherency), PCIe 6.0/7.0 (peripheral I/O), and 400G/800G Ethernet fabrics.

What we build

Bring us the whole stack.

Tell us where latency is costing you, from the die to the data center to the control room. An architect replies with a first read of the problem, not a sales deck.