Electronic Design Automation (EDA) for Advanced Nodes
From RTL to a mask-ready GDSII at 3nm
- RTL
- GDSII
- DRC/LVS
- GAAFET
- 3nm
- 5nm
Industry
Fabless Chip Design Houses
EDA flows, SerDes IP, and interconnect logic for 3nm and GAAFET designs.
Tape-out at an advanced node is decided by the quality of the flow and the IP that surrounds the core. We deliver the synthesis and place-and-route algorithms, the 224 Gbps PHY blocks, and the UCIe, CXL, and PCIe stacks that turn a design into a shippable die.
What we see
- Clock skew and parasitics that only emerge at 3nm and below
- Chiplet links and memory coherency that the design team cannot build in-house
- Off-the-shelf SerDes that cannot close a channel with more than 40 dB of loss
What we bring
High-Speed SerDes and Chip IP
PAM4 and NRZ transceivers up to 224 Gbps per lane
- PAM4
- NRZ
- FFE/DFE
- CDR
- BIST
- 224 Gbps
High-Speed Interconnect Standards
UCIe, CXL 3.x, PCIe 6.0/7.0, and 800G Ethernet logic
- UCIe
- CXL 3.x
- PCIe 6.0
- PCIe 7.0
- 400G
- 800G Ethernet
How we help
What we bring to fabless design.
The systems this industry draws on, layer by layer.
01
EDA for Advanced Nodes
A suite of algorithms that convert RTL (Register-Transfer Level) code into a physical GDSII file ready for mask generation.
What we build02
SerDes & Chip IP
Mixed-signal PHY IP blocks including PAM4/NRZ transceivers up to 224Gbps per lane, adaptive equalizers (FFE/DFE) for >40dB channel loss, clock-data recovery (CDR) circuits, and built-in self-test (BIST) for link health monitoring.
What we build03
Interconnect Standards
Protocol stack implementations and bridge architectures for UCIe (die-to-die chiplet links), CXL 3.x (memory pooling and coherency), PCIe 6.0/7.0 (peripheral I/O), and 400G/800G Ethernet fabrics.
What we buildBring us the whole stack.
Tell us where latency is costing you, from the die to the data center to the control room. An architect replies with a first read of the problem, not a sales deck.